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  • In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser cutting. All methods are typically automated to ensure precision and accuracy. Following the dicing process the individual silicon chips are encapsulated into chip carriers which are then suitable for use in building electronic devices such as computers, etc.

  • Soldering provides reasonably permanent but reversible connections between copper pipes in plumbing systems as well as joints in sheet metal objects such as food cans, roof flashing, rain gutters and automobile radiators.