July 2015

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Automotive industry driving optoelectronics

28 July 2015
by: admin
in: Technology
note: Comments

Car ownership is increasing in emerging markets as cars become more technologically advanced in others. Infrared components and LEDs are playing an increasingly prominent role in this sector. Infrared components, such as light sensors, can be used to detect ambient light to determine when everyone ought to switch on or off headlamps. These types of sensors can also be used to determine whether rain is on the windshield or whether to turn on or off the windscreen wipers. There are also new emerging applications for these kind of infrared components as well. Such as gestured control for the infotainment console in the center of the car. And also there's another application such as night vision to determine whether there's objects or sharp bends in the road. read more...

3D TSV Packages Market Segments and Forecast By End-use Industry 2016-2026

27 July 2015
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in:
note: Comments

Currently, 3D Packaging using Through Silicon Via technology (3D TSV) is one of the hottest topics in the semiconductor ecosystem. 3D TSV is vertical electrical connection (via) passing completely through a silicon wafer or die. These short vertical interconnects are replacing the long interconnects of 2D packaging technologies including wire-bond and flip chips. read more...

Packaging Automation Overcomes Optoelectronic Component Variety

27 July 2015
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in:
note: Comments

With the emergence of high-performance digital systems and the rapid growth of Internet traffic in the 1990s, the US Air Force Research Laboratory (AFRL) Micro Electronics Technology Directorate correctly predicted the growing need for optical interconnects and thus initiated several efforts to develop such technologies for the next generation of high-performance digital systems. This work was also prompted by significant advances in optical materials (i.e., III-V materials and polymers), devices (vertical-cavity surface-emitting lasers, VCSELs), and packaging technologies that were also made during this period.1 In collaboration with the Defense Advanced Research Projects Agency (DARPA) Electronic Technology Office, the AFRL thus initiated several major programs in this area. read more...

Ireland, US team to advance integrated optoelectronics packaging

27 July 2015
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A $3 million research collaboration involving several US, Northern Ireland and Republic of Ireland institutions will seek to improve optical integrated chip technology for use in data centers. Scientists at the University of Arizona (UA) in Tucson said the goal is improving the agility of high-bandwidth optical connections that support high-capacity cloud applications. read more...

Consortium advances solutions for high-volume chip packaging

27 July 2015
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in:
note: Comments

In today’s mobile and connected world, consumers demand next-generation devices that are multi-functional, more compact, offer better performance, and consume less power. As the industry moves towards more innovative technologies to keep pace with market trends, it must also keep manufacturing costs low to remain competitive. read more...