July 2015

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Wafer Sawing

27 July 2015
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In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser cutting. All methods are typically automated to ensure precision and accuracy. Following the dicing process the individual silicon chips are encapsulated into chip carriers which are then suitable for use in building electronic devices such as computers, etc. read more...

Wire Soldering

26 July 2015
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Soldering provides reasonably permanent but reversible connections between copper pipes in plumbing systems as well as joints in sheet metal objects such as food cans, roof flashing, rain gutters and automobile radiators. read more...

Nanostructured metal coatings let the light through for electrical devices

25 July 2015
by: admin
in: Technology
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CHAMPAIGN, Ill. – Light and electricity dance a complicated tango in devices like LEDs, solar cells and sensors. A new anti-reflection coating developed by engineers at the University of Illinois at Urbana Champaign, in collaboration with researchers at the University of Massachusetts at Lowell, lets light through without hampering the flow of electricity, a step that could increase efficiency in such devices. read more...

Optoelectronics, sensors/actuators, and discretes growth accelerates

25 July 2015
by: admin
in: Sensors
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Following two lethargic years of low growth and some setbacks, worldwide sales of optoelectronics, sensors, actuators, and discrete semiconductors regained strength in 2014 and collectively increased 9 percent to reach an all-time high of $63.8 billion after rising just 1 percent in 2012 and 2013, according to IC Insights’ new 2015 O-S-D Report—A Market Analysis and Forecast for Optoelectronics, Sensors/Actuators, and Discretes. Modest gains in the global economy, steady increases in electronic systems production, and higher unit demand in 2014 drove a strong recovery in discretes along with substantial improvements in sensors/actuators and greater growth in optoelectronics, says the new 360-page annual report, which becomes available in March 2015. read more...

Nanocavity Paves Way for Thinner Solar Panels, Optoelectronic Devices

25 July 2015
by: admin
in: Technology
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Researchers have been looking for ways to improve energy absorption and transfer to improve photovoltaics and optoelectronics. We told you recently how scientists invented new energy-carrying particles to this end, and now researchers at the University of Buffalo (UB) are experimenting with nanotechnology to improve the design of ultrathin solar panels, video cameras, and other optoelectronic devices. read more...